Chip Based Materials

AMED

Materials for Si/Glass/Plastic Chips

Wafer

< Si wafer >

- Substrate size : up to 8 inch ( Grade : Dummy, Test, Prime )

- Orientation : (100), (110), (111)

- Thickness : 100 ~ 1000 um

< Glass wafer >

- Substrate size : up to 8 inch

- Type : Borofloat33, Eagle XG, Quartz, Fused Silica

< Plastic substrate >

- Type : COC, PMMA, PS, PDMS etc.,

< Other wafers >

- Type : ITO wafer, SOG wafer, SOI wafer etc.,

Materials for photolithography

< Photoresist >

- AZ series : GXR601, 5214E, 9260 etc.,

- SU series : 2002, 2005, 2010, 2025, 2050, 2100 etc.,

- AR-N series : 4400-10, 4400-25, 4400-50others

- Others : PI series, JSR(THB 151N), etc.,

Materials for process

Developers : AZ MIF 300, AZ 400K , SU-8 Developer, JSR Developer etc.,

Etching Solution : TMAH, KOH, Au etchant, CR-7, Al etchant etc.,

Electroplating solution : Ni

Other solution : Lift off solution